Addressing the production challenges associated with FPCs (flexible printed circuits), flexible circuit boards, soft boards, ultra-thin boards and high-density circuit boards—such as susceptibility to deformation, tearing and damage, as well as stringent precision requirements—we provide stress-free, dust-free, high-precision and fully automated solutions for the de-panelling, cutting, forming and inspection of flexible circuit boards. The solution employs flexible clamping, vacuum suction and precise positioning technologies to ensure that circuits are not damaged, boards are not torn, and there is no deformation or discolouration during the panel separation process, thereby safeguarding the integrity of the circuit board’s appearance and performance. It is compatible with flexible circuit board products of the smallest dimensions, thinnest thicknesses and highest densities, and automatically adapts to product changes across different specifications and models, enabling rapid changeover without complex debugging. It also integrates in-line dust removal, static elimination, quality inspection, automatic material collection and data monitoring functions, achieving a fully automated production process that is dust-free, static-free and damage-free. This helps enterprises address core challenges in FPC production—such as high difficulty, low yield rates, low efficiency and susceptibility to damage—thereby improving production yield and efficiency, and meeting the high-quality and high-stability production requirements of flexible printed circuits for high-end electronic products.