The XJPP-3AB is a multi-functional thermal pulse welding machine developed by Xiangjie Technology for high-density electronic connections. Featuring pulse heating, CNC temperature control and a precision crimping mechanism, it is specifically designed for the precision crimping and welding of FPCs, FFCs, TABs, TCPs and PCBs, offering rapid heating, uniform temperature distribution and precise crimping. It is suitable for high-precision welding stations in mobile phones, displays and connectors, meeting the requirements of multi-variety, small-batch production and automated production lines.
Key features
Adjustable heating rate to suit different product processes
Welding heads made from specialised materials ensure uniform heat and pressure distribution across the product
Equipped with vacuum suction for more precise and convenient product alignment
Fully digital temperature control with a touchscreen and Chinese/English interface, PLC-controlled for simple operation
Digital pressure gauge with preset pressure range; high downward pressure accuracy; capable of bonding products with pad spacings as small as 0.5 mm
Supports automatic left-right shifting for welding multiple products in a single setup, ensuring high efficiency
XY-axis stepper motor control and Z-axis precision guide rail cylinder for accurate and reliable positioning
Suitable for high-density TAB, TCP, FPC, FFC, TFT and PCB bonding and pressing
| Parameter Item | Specification |
|---|---|
| Equipment Model | XJPP-3AB |
| Working Area | 250×300 mm |
| Operating Voltage | 380VAC 3PH 9KW |
| Working Air Pressure | 0.5–0.7 MPa |
| Machine Weight | 180 KG |
| Overall Dimension (L×W×H) | 800×800×880 mm |
| Temperature Control Mode | Pulse Heating, CNC Precision Temperature Control |
| Operation Interface | Touch Screen, Chinese/English Display |
| Control Mode | PLC Control |
| Pressure Control | Digital Pressure Gauge, Adjustable Pressure |
| Alignment Assistance | Vacuum Adsorption Function |
| Applicable Products | Precision Bonding & Welding for FPC, FFC, TAB, TCP, PCB, TFT |
| Minimum Pad Pitch | Up to 0.5 mm |
| Safety Protection | Standard Safety Protection Structure |