Product Overview
The XJ-YL-16C Portable Stress Tester is a high-precision stress detection device developed by Xiangjie Technology specifically for the SMT/PCB industry. Positioned as an expert in SMT stress detection and diagnosis, it is primarily used for the real-time monitoring and analysis of mechanical stress in PCB/PCBA processes such as panel separation, soldering, assembly and testing. It serves as a key inspection tool for ensuring production yield and preventing solder cracking and component damage.
Key features
Real-time collection of stress and strain data during PCB processes such as panel splitting, stamping, soldering, and ICT/FCT testing
Supports single-axis, dual-axis and triaxial strain gauge testing, enabling simultaneous monitoring of stress variations across multiple measurement points
Automatically generates professional stress test reports, providing a clear visual representation of stress peaks, waveforms and risk points
Portable design, suitable for rapid testing in various settings including production workshops and laboratories
Key features
16-channel synchronous data acquisition: Simultaneous monitoring of multiple measurement points to comprehensively capture stress variations throughout the entire manufacturing process
High precision and high sampling rate: Accurately captures millisecond-level stress spikes to prevent potential damage from being overlooked
Portable and user-friendly: Compact design, plug-and-play functionality, one-click report generation, and low learning curve
Suitable for the entire manufacturing process: Covers stress detection requirements throughout the entire process, including panel separation, soldering, assembly and testing
Professional analysis capabilities: Comes with analysis software supporting stress data traceability and threshold alerts
Suitable scenarios
Stress testing for PCB depaneling (knife-edge, milling cutter, and laser depaneling)
Stress monitoring for FPC/PCB pulse hot-press bonding
Stress detection during ICT/FCT functional testing and assembly processes
Quality control of PCB manufacturing processes in the consumer electronics, automotive electronics, and new energy sectors
| Parameter Item | Specification Details |
|---|---|
| Product Model | XJ-YL-16C |
| Number of Channels | 16 channels synchronous acquisition |
| Sampling Rate | Up to 10KHz/channel (high-speed sampling, fully capturing transient stress) |
| ADC Resolution | 24-bit high-precision acquisition |
| Measurement Range | ±20000µε (microstrain) |
| Resolution | 1µε |
| Measurement Accuracy | ≤±0.2% (0.2 grade) |
| Supported Bridge Types | Full bridge, half bridge, quarter bridge (2-wire / 3-wire system) |
| Supported Strain Gauge Resistance | 120Ω / 350Ω |
| Interface Type | USB2.0 high-speed transmission |
| Power Supply | 220VAC / 11-30VDC (dual power supply, compatible with on-site / portable scenarios) |
| Working Environment | Temperature: -40°C~70°C, Humidity: 10%~90% RH (non-condensing) |
| Supporting Functions | Professional stress analysis software, automatic test report generation, threshold alarm |
| Body Design | Portable integrated chassis, convenient for on-site use in workshops |